Home>Phone Repair Tool>BGA Reballing Stencil>Wylie WL64 IC Reball stencil SDM710 SDM450 SDM660 MT6771V MT6757V MT6763V MT6739V MT6762V CPU BGA Stencil Reballing Template

Wylie WL64 IC Reball stencil SDM710 SDM450 SDM660 MT6771V MT6757V MT6763V MT6739V MT6762V CPU BGA Stencil Reballing Template Item NO.: Wylie WL-64

$ 0.55

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Wylie WL-64	$ 3.54	Stock(500)	- +

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Product Name	Wylie WL64 IC Reball stencil SDM710 SDM450 SDM660 MT6771V MT6757V MT6763V MT6739V MT6762V CPU BGA Stencil Reballing Template
Item NO.	Wylie WL-64
Weight	0.05 kg = 0.1102 lb = 1.7637 oz
Category	Phone Repair Tool > BGA Reballing Stencil
Tag	BGA Reballing Stencil
Creation Time	2021-03-08

Product Information

Product Type	Hand Tool Parts
Place of Origin	China
Brand Name	WYLIE
Model Number	Wylie WL-64
China	Guangdong
is_customized	No
Material	Aluminium-copper Alloy
Usage	Home DIY
Function 1:	mtk cpu stencil
Function 2:	mtk ic
Function 3:	cpu mtk
Function 4:	bga mtk stencil

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A broad range of after-sales services and support ensuring top-quality standards, fast problem resolution and the ability to establish a positive product experience

Expertly trained teams providing customer service, repairs and maintenance, on-the-spot training and know-how transfer

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