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Home>Phone Repair Tool>BGA Reballing Stencil>MSM8998 RAM/CPU For LG V30/H930DS PMIC POWER AUDIO WIFI IC CHIP BGA TIN Reballing Stencil Solder Template
MSM8998 RAM/CPU For LG V30/H930DS PMIC POWER AUDIO WIFI IC CHIP BGA TIN Reballing Stencil Solder Template

MSM8998 RAM/CPU For LG V30/H930DS PMIC POWER AUDIO WIFI IC CHIP BGA TIN Reballing Stencil Solder Template Item NO.: AMAOE LG3

$ 0.67
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AMAOE LG3 $ 4.27 Stock(500)
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Product Name MSM8998 RAM/CPU For LG V30/H930DS PMIC POWER AUDIO WIFI IC CHIP BGA TIN Reballing Stencil Solder Template
Item NO. AMAOE LG3
Weight 0.05 kg = 0.1102 lb = 1.7637 oz
Category Phone Repair Tool > BGA Reballing Stencil
Tag BGA Reballing Stencil
Creation Time 2021-03-08

Product Information
 
 
 
Brand Name HCQS
Model Number AMAOE LG3
Function1: FOR LG BGA STENCIL
Function2: For VIVO BGA STENCIL
Function3: note 3 BGA STENCIL
Function4: N935F/N9500 BGA STENCIL
Function5: X6 BGA STENCIL
Function6: J5/J6/J7 BGA STENCIL
 
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We offer you

A broad range of after-sales services and support ensuring top-quality standards, fast problem resolution and the ability to establish a positive product experience 

Expertly trained teams providing customer service, repairs and maintenance, on-the-spot training and know-how transfer

 
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