Home>Phone Repair Tool>BGA Reballing Stencil>MSM8998 RAM/CPU For LG V30/H930DS PMIC POWER AUDIO WIFI IC CHIP BGA TIN Reballing Stencil Solder Template

MSM8998 RAM/CPU For LG V30/H930DS PMIC POWER AUDIO WIFI IC CHIP BGA TIN Reballing Stencil Solder Template Item NO.: AMAOE LG3

$ 0.66

model:
AMAOE LG3	$ 4.24	Stock(500)	- +

Quantity: 0 , Subtotal 0

Trade please contact our sales manager to get the best price

Product Name	MSM8998 RAM/CPU For LG V30/H930DS PMIC POWER AUDIO WIFI IC CHIP BGA TIN Reballing Stencil Solder Template
Item NO.	AMAOE LG3
Weight	0.05 kg = 0.1102 lb = 1.7637 oz
Category	Phone Repair Tool > BGA Reballing Stencil
Tag	BGA Reballing Stencil
Creation Time	2021-03-08

Product Information

Brand Name	HCQS
Model Number	AMAOE LG3
Function1:	FOR LG BGA STENCIL
Function2:	For VIVO BGA STENCIL
Function3:	note 3 BGA STENCIL
Function4:	N935F/N9500 BGA STENCIL
Function5:	X6 BGA STENCIL
Function6:	J5/J6/J7 BGA STENCIL

Product Display

CompanyInfo

Company Profile

undefined

Product Process

Production Process

undefined

Certifications

undefined

Product Packaging

undefined

Shipment & Payment

Our Advantages

We offer you

A broad range of after-sales services and support ensuring top-quality standards, fast problem resolution and the ability to establish a positive product experience

Expertly trained teams providing customer service, repairs and maintenance, on-the-spot training and know-how transfer

undefined