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CopyProduct Name | MSM8998 RAM/CPU For LG V30/H930DS PMIC POWER AUDIO WIFI IC CHIP BGA TIN Reballing Stencil Solder Template |
Item NO. | AMAOE LG3 |
Weight | 0.05 kg = 0.1102 lb = 1.7637 oz |
Category | Phone Repair Tool > BGA Reballing Stencil |
Tag | BGA Reballing Stencil |
Creation Time | 2021-03-08 |
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