Home>Phone Repair Tool>BGA Reballing Stencil>3D IC Chip BGA Reballing Stencil Kits Set A8 A9 A10 A11 A12 stencil tin plate hand tools for iPhone 6 7G 8G 8P XR XS MAX series

3D IC Chip BGA Reballing Stencil Kits Set A8 A9 A10 A11 A12 stencil tin plate hand tools for iPhone 6 7G 8G 8P XR XS MAX series Item NO.: MJ 3D BGA Reballing Stencil Template

$ 1.87

model:
A8	$ 0.89	Stock(500)	- +
A9	$ 0.89	Stock(500)	- +
A10	$ 0.89	Stock(500)	- +
A11	$ 0.89	Stock(500)	- +
A12-1	$ 0.89	Stock(500)	- +
A12-2	$ 0.89	Stock(500)	- +
A13	$ 0.89	Stock(500)	- +

Quantity: 0 , Subtotal 0

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Product Name	3D IC Chip BGA Reballing Stencil Kits Set A8 A9 A10 A11 A12 stencil tin plate hand tools for iPhone 6 7G 8G 8P XR XS MAX series
Item NO.	MJ 3D BGA Reballing Stencil Template
Weight	0.05 kg = 0.1102 lb = 1.7637 oz
Category	Phone Repair Tool > BGA Reballing Stencil
Tag	BGA Reballing Stencil
Creation Time	2021-03-08

Product Information

Brand Name	HCQS
Model Number	MJ 3D BGA Reballing Stencil Template
1	for iPhone 6 7G 8G 8P XR XS MAX

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A broad range of after-sales services and support ensuring top-quality standards, fast problem resolution and the ability to establish a positive product experience

Expertly trained teams providing customer service, repairs and maintenance, on-the-spot training and know-how transfer

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