Color: | |||||||||
---|---|---|---|---|---|---|---|---|---|
BASE | $ 11.65 | ||||||||
A13 whole CPU mold | $ 9.59 | ||||||||
A6-A7 whole cpu mold | $ 9.59 | ||||||||
A11 whole CPU mold | $ 9.59 | ||||||||
A12 whole CPU mold | $ 9.59 | ||||||||
A8 whole CPU mold | $ 19.19 | ||||||||
A9 whole CPU mold | $ 19.19 | ||||||||
A10 whole CPU mold | $ 19.19 | ||||||||
A8 Upper | $ 9.59 | ||||||||
A6 Upper | $ 9.59 | ||||||||
A9 Upper | $ 9.59 | ||||||||
A9 Lower | $ 9.59 | ||||||||
A8 Lower | $ 9.59 | ||||||||
A10 Upper | $ 9.59 | ||||||||
A10 Lower | $ 9.59 | ||||||||
A7 Upper | $ 9.59 | ||||||||
Quantity: 0 , Subtotal 0 |
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CopyProduct Name | WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 A13 CPU Upper Lower Soldering rework tool |
Item NO. | 1033 |
Weight | 0.1 kg = 0.2205 lb = 3.5274 oz |
Category | Phone Repair Tool > BGA Reballing Stencil |
Creation Time | 2021-05-24 |
High Quality WL BGA Reballing Stencil Kit for iPhone 6G 6S 7G 8G X XS XSMAX A7 A8 A9 A10 A11 A12 CPU Upper Lower Soldering Precise positioning mold
Product description:
Optional 1Magnetic baseThis is a universal mold
Optional 2A11 whole cpu mold
Optional 3A12 whole cpu mold
Optional 4A8 whole cpu mold
Optional 5A 9 whole cpu mold
Optional 6A10 whole cpu mold
Optional 7A8 Upper
Optional 8A8 lower
Optional 9A9 Upper
Optional 10A9 lower
Optional 11A10 Upper
Optional 12A10 lower
A8-10 There is a separate upper positioning mold and plant tin mesh, A11 A12 is the CPU as a whole into the lower layer cpu plant tin network
With Fixed Plate ( Black Positioning Mold ), Easy to use and more accurate CPU IC welding position.A
[ Option Aluminum Mould Base ]: it is universal, can fit with any Black Positioning Mold,
Option Positioning Mold (Black): Not univeral, can't working with different BGA Reballing Stencil, need the right model BGA Reballing Stencil, the Black Positioning Mold just match with the right BGA Reballing Stencil.
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