model: | |||||||||
---|---|---|---|---|---|---|---|---|---|
MI12 | $ 4.28 | ||||||||
MI11 | $ 4.28 | ||||||||
MI10 | $ 4.28 | ||||||||
MI9 | $ 4.28 | ||||||||
MI8 | $ 4.28 | ||||||||
MI7 | $ 4.28 | ||||||||
MI6 | $ 4.28 | ||||||||
MI5 | $ 4.28 | ||||||||
MI4 | $ 4.28 | ||||||||
MI3 | $ 4.28 | ||||||||
Quantity: 0 , Subtotal 0 |
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CopyProduct Name | For xiaomi 10/9/8/6/5/4/CC9/MIX/Redmi K20/NOTE8/K30 PRO/NOTE/4/4A/5S IC Chip Reballing Stencil Solder BGA Heating Template |
Item NO. | AMAOE MI1-12 |
Weight | 0.05 kg = 0.1102 lb = 1.7637 oz |
Category | Phone Repair Tool > BGA Reballing Stencil |
Tag | BGA Reballing Stencil |
Creation Time | 2021-03-08 |
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