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CopyProduct Name | Wylie WL-368 Glue Remov with Cold and Thin Blade Tech Processors knifes For iPhone CPU Mainboard IC Repair Tool Set |
Item NO. | Wylie WL-368 |
Weight | 0.1 kg = 0.2205 lb = 3.5274 oz |
Category | Phone Repair Tool > Knife |
Tag | BGA Reballing Stencil |
Creation Time | 2021-03-08 |
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