Color: | |||||||||
---|---|---|---|---|---|---|---|---|---|
Sunshine SS-007E | $ 1.28 | ||||||||
Wylie 0.04mm | $ 1.10 | ||||||||
Wylie 0.05mm | $ 1.10 | ||||||||
Wylie 0.06mm | $ 1.10 | ||||||||
Wylie 0.08mm | $ 0.99 | ||||||||
Wylie 0.1mm | $ 0.99 | ||||||||
Quantity: 0 , Subtotal 0 |
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CopyProduct Name | Wylie 0.04mm Highly Flexible Special Tungsten Alloy Wire Flying Line For Mobile Phone CPU Fingerprint Touch Dedicated Repair |
Item NO. | Wylie 0.08mm |
Weight | 0.1 kg = 0.2205 lb = 3.5274 oz |
Category | Phone Repair Tool > Solder Flux & Tin |
Tag | BGA Reballing Stencil |
Creation Time | 2021-03-08 |
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