model: | |||||||||
---|---|---|---|---|---|---|---|---|---|
A13 11pro-MAX | $ 3.60 | ||||||||
A12 XS-XR-XS MAX | $ 3.60 | ||||||||
A11 8-8P-X | $ 3.60 | ||||||||
A10 7-7P | $ 3.60 | ||||||||
A9 6S-6SP | $ 3.60 | ||||||||
A8 6G 6P | $ 3.60 | ||||||||
Quantity: 0 , Subtotal 0 |
Copy and share this link on social network or send it to your friends
CopyProduct Name | Kaisi 0.12mm BGA Reballing Stencil Kit Set Solder Template for iPhone CPU A8 A9 A10 A11 A12 A13 11 Pro Max XS XR X 8 8P 7P 6S 6 |
Item NO. | BGA Reballing Stencil CPU A8 A9 A10 A11 A12 A13 11 Pro Max XS XR |
Weight | 0.05 kg = 0.1102 lb = 1.7637 oz |
Category | Phone Repair Tool > BGA Reballing Stencil |
Tag | BGA Reballing Stencil |
Creation Time | 2021-03-08 |
Copyright © 2015-2024 HCQS INC. All Rights Reserved.
No related record found