model: | |||||||||
---|---|---|---|---|---|---|---|---|---|
6-6P | $ 6.50 | ||||||||
iPhone 11pro-MAX | $ 6.50 | ||||||||
6S-6SP | $ 6.50 | ||||||||
XS-XR-XS MAX | $ 6.50 | ||||||||
6pcs 1 set | $ 6.50 | ||||||||
7-7P | $ 6.50 | ||||||||
8-8P-X | $ 6.50 | ||||||||
Quantity: 0 , Subtotal 0 |
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CopyProduct Name | High quality IC Chip BGA Reballing Stencil Kits Set Solder Template for iPhone 11 pro Max XS XR X 8 7 6S 6 Plus |
Item NO. | BGA Reballing Stencil IC Chip BGA Reballing |
Weight | 0.05 kg = 0.1102 lb = 1.7637 oz |
Category | Phone Repair Tool > BGA Reballing Stencil |
Tag | BGA Reballing Stencil |
Creation Time | 2021-03-08 |
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