model: | |||||||||
---|---|---|---|---|---|---|---|---|---|
IP11pro-MAX | $ 7.12 | ||||||||
IPXS-XR-XS MAX | $ 7.12 | ||||||||
IP8-8P-X | $ 7.12 | ||||||||
IP7-7P | $ 7.12 | ||||||||
IP6S-6SP | $ 7.12 | ||||||||
IP6G 6P | $ 7.12 | ||||||||
Quantity: 0 , Subtotal 0 |
Copy and share this link on social network or send it to your friends
CopyProduct Name | BGA Reballing Stencil Kit Set Solder Template for iPhone 11 pro xs max x 8 8p 7 6s 6 CPU RAM POWER WIFI U2 AUDIO CHIP IC |
Item NO. | BGA Reballing Stencil CPU RAM POWER WIFI U2 AUDIO CHIP IC |
Weight | 0.05 kg = 0.1102 lb = 1.7637 oz |
Category | Phone Repair Tool > BGA Reballing Stencil |
Tag | BGA Reballing Stencil |
Creation Time | 2021-03-08 |
Copyright © 2015-2024 HCQS INC. All Rights Reserved.
No related record found